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6538 积分 2026-05-12 加入
Exploring Molecular Complexity by N‐Heterocyclic Carbene Organocatalysis: New Activation and Reaction Diversity
1天前
已完结
Organocatalytic C−H Functionalization of Simple Alkanes
1天前
已完结
Carbene‐Catalyzed Intermolecular Dehydrogenative Coupling of Aldehydes with C(sp3)−H Bonds
1天前
已完结
N‐Heterocyclic carbene enabled functionalization of inert C(sp3)‐H bonds via hydrogen atom transfer (HAT) processes
1天前
已完结
Design and Enantioselective Synthesis of Chiral Pyranone Fused Indole Derivatives with Antibacterial Activities against Xanthomonas oryzae pv oryzae for Protection of Rice
1天前
已完结
Enones from aldehydes and alkenes by carbene-catalyzed dehydrogenative couplings
1天前
已完结
Ionic Hydrogen Bond‐Assisted Catalytic Construction of Nitrogen Stereogenic Center via Formal Desymmetrization of Remote Diols
1天前
已完结
Catalyst Control over S(IV)-stereogenicity via Carbene-derived Sulfinyl Azolium Intermediates
1天前
已完结
Synthesis of P(V)-Stereogenic Phosphorus Compounds via Organocatalytic Asymmetric Condensation
1天前
已完结
Assembly of Molecular Complexity by Carbene Organocatalytic Multicomponent Reactions Involving α,β‐Unsaturated Aldehydes
1天前
已完结
Event-Triggered Disturbance Rejection Control for Brain-Actuated Mobile Robot: An SSA-Optimized Sliding Mode Approach
1天前
已采纳
Generic Cryogenic CMOS Device Modeling and EDA-Compatible Platform for Reliable Cryogenic IC Design
1天前
已采纳
Enhancing Data Literacy On-Demand: LLMs as Guides for Novices in Chart Interpretation
1天前
待审核
Industry Corner Live With STIMIT CEO Ronja Mueller
1天前
已采纳
Broadband Characterization of Newly Developed ABF Type A Material for Advanced Packaging and mmWave Applications
1天前
已采纳
Simulation and Prediction of Vehicle EMC Radiation Performance Based on Near Field Scanning
1天前
已采纳
Vacuum Deposited High Voltage CsPbBr3 Perovskite Solar Cell with Methylammonium-Chloride Post- Treatment
1天前
已采纳
Myocardial Infarction Detection with Incomplete Multi-View Data via Dual-Branch Gating Completion and Dirichlet Weighting
1天前
待审核
Analysis of Shrinkage-Induced Dimensional Mismatch in 3D-Printed Packaging Substrates for Flip-Chip Bonding
1天前
已采纳
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