Lv5
910 积分 2025-08-14 加入
Thermo-mechanical Analysis of Thermal Compression Bonding Chip-Join Process
9个月前
已完结
High-Performance Flip Chip Bonding Mechanism Study with Laser Assisted Bonding
9个月前
已完结
Process Development and Reliability Investigation of 120 mm × 120 mm Large 2.5D Package with Low Melting Temperature Solder
10个月前
已完结
Heterogeneous Integration of Fiber-Based Copackaged Optics with EMIB Technology: Assembly, Performance, and Reliability
10个月前
已完结
EMIB-T (TSV) Advanced Packaging Technology EMIB's Next Evolution
10个月前
已完结
6.4Tbps, 224Gbps/Lane Co-Packaged Optical Engines With Fine Pitch Through-Package Interconnects: Powering AI/ML and Next-Gen Data Centers
10个月前
已完结
Optical and Electrical Characterization of a Compact Universal Photonic Engine
10个月前
已完结
X64 UCIe Chiplet Interconnection at 32 GT/s on a Silicon Core Substrate
10个月前
已完结
Optimization of Alignment Model and Metrology During Backside EUV Lithography Patterning for CFET Technology
10个月前
已完结
Optimized TIM1 Solution for Large 2.5D HPC Packages Using Silicone Matrix Containing Liquid Metal Materials
10个月前
已完结
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