Lv4
420 积分 2024-06-04 加入
Characterization of local strain/stress in copper through-silicon via structures using synchrotron x-ray microdiffraction, electron backscattered diffraction and nonlinear thermomechanical model
5个月前
已完结
Characterization of Local Strain around Through-Silicon Via Interconnects by Using X-ray Microdiffraction
5个月前
已完结
Strain engineering in metal halide perovskite materials and devices: Influence on stability and optoelectronic properties
5个月前
已完结
Probing the Structural Dynamics of In
6个月前
已完结
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