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Influence of TiO2 nanoparticles addition on the microstructural and mechanical properties of Sn0.7Cu nano-composite solder
3个月前
已完结
The role of microstructure in the thermal fatigue of solder joints
3个月前
已完结
Titanium microalloying of steel: A review of its effects on processing, microstructure and mechanical properties
3个月前
已完结
Advances in micro/nanoparticle-enhanced Sn-based composite solders
3个月前
已完结
Oxidation resistance of a near α high temperature Ti-based alloy: Emphasis on TiO2 and Al2O3 phases
3个月前
已完结
Effects of Mo nanoparticles on growth of compounds layer and strength of Sn3.0Ag0.5Cu/Cu solder joint during thermal cycling
3个月前
已完结
Microstructure evolution and strengthening mechanism of Al2O3/Kovar joints brazed with TiB enhanced Ag-Cu-Ti based composite fillers
3个月前
已关闭
Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics
3个月前
已完结
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