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30 积分 2024-03-01 加入
A Tale of Two Hierarchies: Interactive Effects of Power Differentiation and Status Differentiation on Team Performance
5个月前
已完结
Vacuum Reflow Process Optimization for Solder Void Size Reduction in Semiconductor Packaging Assembly
7个月前
已完结
Voids in First-Level Interconnects and Their Impact on Solder Joint Reliability
7个月前
已完结
Conformal slip-free wafer chucking using an actuated wafer table
11个月前
已完结
Heat transfer mechanism of electrostatic chuck surface and wafer backside to improve wafer temperature uniformity
11个月前
已完结
Model updating of a temperature field simulation of a printed circuit board assembly based on the Kriging model
11个月前
已完结
Systematic literature review of human–machine collaboration in organizations using bibliometric analysis
1年前
已完结
Combining Human and Artificial Intelligence: Hybrid Problem-Solving in Organizations
1年前
已完结
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