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1890 积分 2024-03-29 加入
Investigation Into Loose Abrasive Machining for Silicon Carbide
6天前
已完结
The Influence of Machining Conditions on Performance of Diamond Grinding of Silicon Carbide Ceramic Balls
6天前
已完结
Effects of nanoindentation tip radius on the first dislocation pop‐in behavior in 4H SiC single crystal
8天前
已完结
Optimizing the flatness of 4H-silicon carbide wafers by tuning the sequence of lapping
17天前
已完结
Machining of Silicon Carbide Plates with a Bonded Diamond Tool
17天前
已完结
Molecular Dynamics Simulation of the Nanogrinding Process on Hard‐Brittle Materials With Diamond Grit
17天前
已完结
A grinding-based manufacturing method for silicon wafers: an experimental investigation
20天前
已完结
Simultaneous double side grinding of silicon wafers: a literature review
20天前
已完结
Numerical and experimental investigation on flow field during fixed abrasive lapping for structural optimization of lapping tool
28天前
已完结
Two‐Dimensional Wafer‐Scale Chemical Mechanical Planarization Models Based on Lubrication Theory and Mass Transport
29天前
已完结
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