Lv2
190 积分 2022-04-20 加入
Effect of chip and bonding defects on the junction temperatures of high-brightness light-emitting diodes
4个月前
已完结
Sintering of SiC chip via Au80Sn20 solder and its joint strength and thermomechanical reliability
4个月前
已完结
Superior Short-Circuit Performance of SiC Superjunction MOSFET
4个月前
已完结
Avalanche and Short Circuit Withstand Capabilities in 3.3 kV-Class SiC Superjunction MOSFET
4个月前
已完结
A New Layout Method for Junction Field Effect Transistors (JFETs) on 4H-SiC that Provides a Significant Reduction in On-Resistance
9个月前
已完结
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