Lv11
18 积分 2026-06-26 加入
Assessment of the Risk of Crack Formation at a Hybrid Bonding Interface Using Numerical Analysis
1小时前
待确认
Quantitative analysis of plasma-enhanced chemical vapor deposition mechanisms: Quantum chemical and plasma-fluid dynamics investigation on tetraethoxysilane/O2 plasma
1小时前
已完结
Pre-metal dielectric PE TEOS oxide pitting in 3D NAND: mechanism and solutions
1小时前
已完结
Etching and annealing treatment to improve the plasma-deposited SiOx film adhesion force
2小时前
已完结
Stress analysis and characterization of TEOS-based PECVD fabricated SiO2 solid films after thermal annealing
4个月前
已完结
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