Lv3
390 积分 2024-04-08 加入
Experimental research on the influence of working parameters on the drilling efficiency
23天前
已完结
Experimental and Simulation Performance of Dynamic Behavior and Impact System for Hydraulic Rock Drill
23天前
已完结
Thermo-mechanical reliability of glass substrate and Through Glass Vias (TGV): A comprehensive review
1个月前
已完结
Research on high-power high-frequency electrical transmission characteristics of through glass via interconnections
1个月前
已完结
P‐136: Process Optimization for Fabrication of 3D Through Glass Via (TGV) Inductor
1个月前
已完结
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
1个月前
已关闭
A Fully Integrated Solid-State Charge Detector with through Fused Silica Glass via Process
1个月前
已完结
Correlations between Microstructure and Residual Stress of Nanoscale Depth Profiles for TSV-Cu/TiW/SiO2/Si Interfaces after Different Thermal Loading
2个月前
已完结
Rough Interface Effect on High-Temperature Reliability of TSV for Electronic Packaging
2个月前
已完结
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