Lv4
512 积分 2024-04-08 加入
Investigating on Through Glass via Based RF Passives for 3-D Integration
28天前
已完结
Electrical characterization of through glass vias based inductors in 3-D integration
28天前
已完结
Precise RLGC modeling and analysis of through glass via (TGV) for 2.5D/3D IC
28天前
已完结
High frequency characterization and analytical modeling of through glass via (TGV) for 3D thin-film interposer and MEMS packaging
28天前
已完结
Understanding and eliminating thermo-mechanically induced radial cracks in fully metallized through-glass via (TGV) substrates
2个月前
已完结
Time and Temperature Dependence of Copper Protrusion in Metallized Through-Glass Vias (TGVs) Fabricated in Fused Silica Substrate
2个月前
已关闭
Low-Cost Thin Glass Interposers as a Superior Alternative to Silicon and Organic Interposers for Packaging of 3-D ICs
2个月前
已完结
Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon
2个月前
已完结
Effect of heat treatment processes on the Cu-electrodeposited through glass vias (TGV) plate
2个月前
已完结
Cornerstone of Next-Generation 3D Integration: Structures, Processes, and Applications of TGV
2个月前
已完结
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