Lv4
480 积分 2024-04-08 加入
Athermal and thermal coupling electromigration effects on the microstructure and failure mechanism in advanced fine-pitch Cu interconnects under extremely high current density
3天前
已完结
Thermo-Mechanical Reliability Study of Through Glass Vias in 3D Interconnection
3天前
已完结
Pulsed Power Electromigration in Copper Metallization (10 Hz – 4 MHz)
4天前
已完结
De-Coupling Thermo-Migration from Electromigration Using a Dedicated Test Structure
4天前
已完结
A combined modelling approach to design test structures to study thermomigration in Cu interconnects
4天前
已完结
Long-term high-temperature aging mechanism of copper-metallized through-glass vias: a combined nanoindentation test and hybrid Potts-phase field simulation study
5天前
已完结
Physics-Based Modeling with Nanoindentation on the Mechanical Reliability of TGV Substrates Under Annealing Effects
5天前
已完结
Investigating on Through Glass via Based RF Passives for 3-D Integration
1个月前
已完结
Electrical characterization of through glass vias based inductors in 3-D integration
1个月前
已完结
Precise RLGC modeling and analysis of through glass via (TGV) for 2.5D/3D IC
1个月前
已完结
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