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354 积分 2024-04-08 加入
Thermo-mechanical reliability of glass substrate and Through Glass Vias (TGV): A comprehensive review
4天前
已完结
Research on high-power high-frequency electrical transmission characteristics of through glass via interconnections
4天前
已完结
P‐136: Process Optimization for Fabrication of 3D Through Glass Via (TGV) Inductor
4天前
已完结
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
4天前
已关闭
A Fully Integrated Solid-State Charge Detector with through Fused Silica Glass via Process
4天前
已完结
Correlations between Microstructure and Residual Stress of Nanoscale Depth Profiles for TSV-Cu/TiW/SiO2/Si Interfaces after Different Thermal Loading
1个月前
已完结
Rough Interface Effect on High-Temperature Reliability of TSV for Electronic Packaging
1个月前
已完结
Evolution of Electrical Transmission Characteristics in TSV and TGV Interconnect Structures Under Thermal Loading
1个月前
已完结
Electromigration reliability of open TSV structures
2个月前
已完结
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