Lv2
188 积分 2024-04-08 加入
Design, analysis and test of high-frequency interconnections in 2.5D package with silicon interposer
8天前
已完结
Design of a 3D Wilkinson power divider using through glass via technology
8天前
已完结
Understanding and eliminating thermo-mechanically induced radial cracks in fully metallized through-glass via (TGV) substrates
10天前
已完结
Time and Temperature Dependence of Copper Protrusion in Metallized Through-Glass Vias (TGVs) Fabricated in Fused Silica Substrate
10天前
已完结
Understanding and eliminating thermo-mechanically induced radial cracks in fully metallized through-glass via (TGV) substrates
10天前
已完结
Thermo-Mechanical Reliability Study of Through Glass Vias in 3D Interconnection
10天前
已完结
The Mechanical Properties and Microstructural Evolution of Copper Pillar in Through Glass Vias under Different Temperatures
10天前
已完结
Universal Liquid Metal Interconnects for Next‐Generation Glass Packaging
10天前
已完结
Formation of Glass Microcrack Induced by Nonuniform Copper Grain Growth in Through Glass Via During Reflow Soldering
10天前
已完结
A New Approach to Stable Optimal Control of Complex Nonlinear Dynamical Systems
10天前
已完结
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