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318 积分 2024-04-08 加入
Electrodeposition of Ni-Fe-based low CTE alloy for void-free through glass via filling to enhance the thermo-mechanical reliability of glass substrate
11小时前
待确认
Advanced Through-Glass Via (TGV) Electro-filling and Solder Bumping for Miniaturized 3D MEMS packaging
11小时前
已完结
A resonant differential pressure sensor with glass reflow TGV packaging and dual-membrane coupling
11小时前
求助中
Evolution of Electrical Transmission Characteristics in TSV and TGV Interconnect Structures Under Thermal Loading
11小时前
已完结
Cornerstone of Next-Generation 3D Integration: Structures, Processes, and Applications of TGV
12小时前
待确认
Microstructure simulation of grain growth in Cu through silicon vias using phase-field modeling
10天前
已完结
Effects of multi-cracks and thermal-mechanical coupled load on the TSV reliability
10天前
已完结
Effect of silicon anisotropy on interfacial fracture for three dimensional through-silicon-via (TSV) under thermal loading
10天前
已完结
Effects of multi-cracks and thermal-mechanical coupled load on the TSV reliability
10天前
已完结
Experimental research on performance degradation of TSV microstructure under thermal cycling, vibration and electrical stress
13天前
已完结
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