Lv11
100 积分 2025-10-24 加入
Solving the rectangular packing problem by an adaptive GA based on sequence-pair
3个月前
已完结
Equivalent parasitic inductance modeling of SiC MOSFET power modules in dynamic current sharing
3个月前
已完结
A Stacked SiC Half-Bridge Power Module with Comprehensive Optimization of Parasitic Capacitance and Parasitic Inductance
4个月前
已完结
Equivalent parasitic inductance modeling of SiC MOSFET power modules in dynamic current sharing
4个月前
已完结
A Multi-terminal Silicon Carbide Power Module with Low Parasitic Inductance
5个月前
已完结
Equivalent parasitic inductance modeling of SiC MOSFET power modules in dynamic current sharing
5个月前
已完结
A Stacked SiC Half-Bridge Power Module with Comprehensive Optimization of Parasitic Capacitance and Parasitic Inductance
5个月前
已完结
A Multi-terminal Silicon Carbide Power Module with Low Parasitic Inductance
5个月前
已完结
Equivalent parasitic inductance modeling of SiC MOSFET power modules in dynamic current sharing
5个月前
已完结
A Novel High-Temperature Planar Package for SiC Multichip Phase-Leg Power Modules
5个月前
已完结