Lv1
32 积分 2023-11-17 加入
Surface activated bonding of SiC/diamond for thermal management of high-output power GaN HEMTs
5天前
已完结
Passive thermal management of electronic devices
6天前
已完结
High Thermal Conductive Ga2O3 MOSFET with Diamond Substrate and its Simulation Analysis
6天前
已完结
Phonon conduction in GaN-diamond composite substrates
13天前
已完结
Research progress on self-heating effects and thermal management strategies of GaN-based electronic devices
13天前
已完结
Governing Thermal Transport in Three-Dimensional Electronics
13天前
已完结
A Review on Additive Manufacturing of Topology Optimized Microchannel Heat Sink
1个月前
已完结
The development of thermal interface materials
2个月前
已完结
Linear embedding-enhanced co-Kriging incorporating distinct projection matrices across fidelity levels
2个月前
已完结
Interfacial Thermal Transport in Top-Side Diamond Integrated AlGaN/GaN High Electron Mobility Transistors
2个月前
已完结