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282 积分 2025-07-17 加入
Reliability issues of lead-free solder joints in electronic devices
1天前
已完结
Recent Advances in Active Infrared Thermography for Non-Destructive Testing of Aerospace Components
1天前
已完结
Welding Defects Detection in Radiographic Images Using an Improved Denoising Technique Combined with an Enhanced Chan-Vese Model
2天前
已完结
Research on Welding Guidance System of Intelligent Perception for Steel Weldment
2天前
已完结
Narrow Weld Joint Recognition Method Based on Laser Profile Sensor
2天前
待确认
A Room Temperature Flip-Chip Technology for High Pixel Count Micro-Displays and Imaging Arrays
1个月前
已完结
Lock-in thermography application in flip-chip packaging for short defect localization
1个月前
已完结
Defects inspection of the solder bumps using self reference technology in active thermography
1个月前
已完结
Language Modeling with Gated Convolutional Networks
1个月前
已完结
SwiftFormer: Efficient Additive Attention for Transformer-based Real-time Mobile Vision Applications
1个月前
已完结
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