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36 积分 2025-02-18 加入
The heterogeneous integration of electronic components
26天前
已完结
A Wafer-Level Three-Dimensional Integration Scheme With Cu TSVs Based on Microbump/Adhesive Hybrid Bonding for Three-Dimensional Memory Application
3个月前
已完结
Nonlinear Coupling Induced Anomalous State Transfer and Complete Multistate Excitation via Adiabatic Control
3个月前
已完结
Nonlinear Coupling Induced Anomalous State Transfer and Complete Multistate Excitation via Adiabatic Control
3个月前
已完结
Current-diffusion model for metasurface structure discoveries with spatial-frequency dynamics
4个月前
已完结
On-chip hotspot thermal delay and peak clipping using a heterogeneously integrated micro-thermoelectric cooler
9个月前
已完结
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