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968 积分 2021-01-18 加入
A comprehensive review of diamond/copper composites for high thermal conductivity applications
15小时前
已完结
Preparation of electrodeposited copper foils with ultrahigh tensile strength and elongation: A functionalized ionic liquid as the unique additive
15小时前
已完结
Design Strategies for Laser Additive Manufacturing of High‐Performance Alloys With Uniform Mechanical Properties
15小时前
已完结
A review of porous-ribbed mini/micro-channel cooling technologies: two-phase thermal management and enhancement strategies
2天前
已完结
Cuproptosis-like death and copper-based nanomaterials: from concept to antibacterial applications
3天前
待确认
Design, properties and applications of additively-manufactured functional hierarchical structure
3天前
求助中
Residual stress and distortion in fusion welding and fusion-based additive manufacturing: measurements, mechanisms and control strategies
3天前
已完结
Monolithic Microfluidic Cooling Using Micropin-Fin Arrays for Local High Heat Flux Remediation: Design Considerations, Experimental Validation, and FPGA Integration
3天前
已完结
Super-nano domains enable strength-conductivity synergy in copper foils
5天前
已完结
Fast Cu-Cu pillar array bonding by thermally stable nanocrystalline Cu
5天前
已完结
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