Lv5
978 积分 2021-01-18 加入
A review of porous-ribbed mini/micro-channel cooling technologies: two-phase thermal management and enhancement strategies
13小时前
已完结
Cuproptosis-like death and copper-based nanomaterials: from concept to antibacterial applications
1天前
求助中
Design, properties and applications of additively-manufactured functional hierarchical structure
1天前
求助中
Residual stress and distortion in fusion welding and fusion-based additive manufacturing: measurements, mechanisms and control strategies
1天前
已完结
Monolithic Microfluidic Cooling Using Micropin-Fin Arrays for Local High Heat Flux Remediation: Design Considerations, Experimental Validation, and FPGA Integration
1天前
已完结
Super-nano domains enable strength-conductivity synergy in copper foils
3天前
已完结
Fast Cu-Cu pillar array bonding by thermally stable nanocrystalline Cu
3天前
已完结
Multi-chip Jet impingement cooling for heat dissipation in 2.5D integrated system with 1 kW+ thermal design power
3天前
已完结
Modeling framework and discussion of microstructural effects on the formation of Cu–Cu bonding interfaces in semiconductor stacking
3天前
已完结
Strengthening by work hardening in nanotwinned Cu foils
4天前
已完结
皖公网安备34019202002308
