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480 积分 2023-10-09 加入
Electrochemical Random-Access Memory: Progress, Perspectives, and Opportunities
17小时前
已完结
III–V-on-silicon solar cells reaching 33% photoconversion efficiency in two-terminal configuration
1个月前
已完结
Quest for More Moore at the End of Device Downsizing
1个月前
已完结
Tungsten Through-Silicon Via Technology for Three-Dimensional LSIs
2个月前
已完结
Comparative TEM study of bonded silicon/silicon interfaces fabricated by hydrophilic, hydrophobic and UHV wafer bonding
4个月前
已完结
Misorientation and Temperature Dependence of Small Angle Twist Grain Boundaries in Silicon: Atomistic Simulation of Directional Growth
4个月前
已完结
Demonstration of acousto-optical modulation based on a thin-film AlScN photonic platform
4个月前
已完结
A triple-wafer-bonded AlScN driven quasi-static MEMS mirror with high linearity and large tilt angles
4个月前
已完结
Wafer-scale bonded GaN–AlN with high interface thermal conductance
4个月前
已完结
Huge differences between low- and high-angle twist grain boundaries: The case of ultrathin (001) Si films bonded to (001) Si wafers
4个月前
已完结
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