Lv4
480 积分 2023-10-09 加入
Comparative TEM study of bonded silicon/silicon interfaces fabricated by hydrophilic, hydrophobic and UHV wafer bonding
1个月前
已完结
Misorientation and Temperature Dependence of Small Angle Twist Grain Boundaries in Silicon: Atomistic Simulation of Directional Growth
1个月前
已完结
Demonstration of acousto-optical modulation based on a thin-film AlScN photonic platform
1个月前
已完结
A triple-wafer-bonded AlScN driven quasi-static MEMS mirror with high linearity and large tilt angles
1个月前
已完结
Wafer-scale bonded GaN–AlN with high interface thermal conductance
1个月前
已完结
Huge differences between low- and high-angle twist grain boundaries: The case of ultrathin (001) Si films bonded to (001) Si wafers
1个月前
已完结
Dislocation structure in low-angle interfaces between bonded Si(001) wafers
1个月前
已完结
Spatial arrangements and types of dislocations in interfacial networks obtained by Si(001) wafer bonding at low twist angle: A TEM characterization
1个月前
已完结
Accurate control of the misorientation angles in direct wafer bonding
1个月前
已完结
3-layer Fine Pitch Cu-Cu Hybrid Bonding Demonstrator With High Density TSV For Advanced CMOS Image Sensor Applications
2个月前
已完结
皖公网安备34019202002308
