Lv2
168 积分 2025-09-16 加入
pH-driven interfacial bond dynamics enable high-efficiency low-damage polishing of fused silica with CeO2 based slurries
1个月前
已完结
Enhancing the Polishing Efficiency of CeO2 Abrasives on the SiO2 Substrates by Improving the Ce3+ Concentration on Their Surface
1个月前
已完结
Pad Characterization and Experimental Analysis of Pad Wear Effect on Material Removal Uniformity in Chemical Mechanical Polishing
1个月前
已完结
The Influence of Inorganic Fillers in TDI-based Polyurethane Pad for Sapphire Substrate Chemical Mechanical Polishing
1个月前
已完结
Pad roughness evolution during break-in and its abrasion due to the pad-wafer contact in oxide CMP
2个月前
已完结
Development and Analysis of a High-Pressure Micro Jet Pad Conditioning System for Interlayer Dielectric Chemical Mechanical Planarization
2个月前
已完结
Modeling the microscale contact status in chemical mechanical polishing process
2个月前
已完结
Investigation of pad wear in CMP with swing-arm conditioning and uniformity of material removal
2个月前
已完结
CMP pad wear and polish-rate decay modeled by asperity population balance with fluid effect
2个月前
已完结
Effect of Process Parameters on Friction Force and Material Removal in Oxide Chemical Mechanical Polishing
2个月前
已完结
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