Lv2
142 积分 2025-09-16 加入
Pad roughness evolution during break-in and its abrasion due to the pad-wafer contact in oxide CMP
6天前
已完结
Development and Analysis of a High-Pressure Micro Jet Pad Conditioning System for Interlayer Dielectric Chemical Mechanical Planarization
7天前
已完结
Modeling the microscale contact status in chemical mechanical polishing process
7天前
已完结
Investigation of pad wear in CMP with swing-arm conditioning and uniformity of material removal
7天前
已完结
CMP pad wear and polish-rate decay modeled by asperity population balance with fluid effect
7天前
已完结
Effect of Process Parameters on Friction Force and Material Removal in Oxide Chemical Mechanical Polishing
7天前
已完结
Improved analysis model for material removal mechanisms of bonnet polishing incorporating the pad wear effect
21天前
已完结
Enhanced material removal modeling in cylindrical bonnet tool polishing: Incorporating time-dependent pad wear effects
26天前
已完结
Polishing pad aging studies on computer controlled optical surfacing finishing for large-scale sapphire optical window
27天前
已完结
The Influence of Inorganic Fillers in TDI-based Polyurethane Pad for Sapphire Substrate Chemical Mechanical Polishing
28天前
已完结
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