| 标题 |
Pad roughness evolution during break-in and its abrasion due to the pad-wafer contact in oxide CMP |
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| DOI | |
| 其它 |
期刊:Microelectronic Engineering 作者:Boris Vasilev; Sascha Bott; Roland Rzehak; Johann W. Bartha 出版日期:2013-05-09 |
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(2025-6-4)