Lv11
40 积分 2025-12-01 加入
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Enhancement of laser-induced plasma-assisted ablation of glass substrate via interacting spatial double laser pulse irradiation
1小时前
求助中
Development of Straight, Small-Diameter, High-Aspect Ratio Copper-Filled Through-Glass Vias (TGV) for High-Density 3D Interconnections
7天前
已完结
Metallization of Helium-Hermetic and Thermo-Mechanically Reliable Through Glass Vias (TGV) by Conformal Pinched Via (CPV) Approach
14天前
已完结
Wettability in lead-free soldering: Effect of plasma treatment in dependence on flux type
21天前
已完结
The Study of Glass Core Substrates Warpage
1个月前
已完结
GAS-LIQUID TWO-PHASE FLOW FIELD ANALYSIS OF TWO PROCESSING TEETH SPIRAL INCREMENTAL CATHODE FOR THE DEEP SPECIAL-SHAPED HOLE IN ECM
1个月前
已完结
MODELING AND OPTIMIZATION OF MACHINING PARAMETERS TO MINIMIZE SURFACE ROUGHNESS AND MAXIMIZE PRODUCTIVITY WHEN TURNING POLYTETRAFLUOROETHYLENE (PTFE)
1个月前
已完结
STUDY OF EXPERIMENTAL AND NUMERICAL SIMULATION OF HIGH-ENERGY LASER PROCESSING ON CARBON FIBER REINFORCED POLYMER
1个月前
已完结
ANALYSIS AND TEST OF CONDUCTIVE SHAFT OF LARGE HORIZONTAL NC ECM MACHINE TOOL
2个月前
已完结
EXPERIMENTAL INVESTIGATION AND PREDICTION MODEL FOR MECHANICAL PROPERTIES OF COPPER-REINFORCED POLYLACTIC ACID COMPOSITES (CU-PLA) USING FDM-BASED 3D PRINTING TECHNIQUE
2个月前
已完结
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