Lv1
16 积分 2025-11-23 加入
Enabling record-high heat flux in wide-bandgap electronics via in-chip microfluidic cooling on diamond substrates
4个月前
已完结
Direct preparation of diamond heat dissipation microchannel assemblies by picosecond laser
5个月前
已完结
Fully diamond-based embedded manifold microchannel heat sink: Achieving ultra-high heat flux cooling
5个月前
已完结
Microchannel cooling for high-performance microelectronic systems: Progress, challenges, and future directions
7个月前
已完结
Microchannel cooling for high-performance microelectronic systems: Progress, challenges, and future directions
7个月前
已关闭
Co-designing electronics with microfluidics for more sustainable cooling
8个月前
已完结
Optimization of embedded cooling for hotspots based on compound plate thermal spreading model
8个月前
已完结
Thermal and hydraulic optimization of embedded manifold microchannel heat sink for chip cooling based on Tesla-pattern
8个月前
已完结
Cooling chip on PCB by embedded active microchannel heat sink
8个月前
已完结
Multi-objective topology optimization of through-silicon-via (TSV)-embedded microchannel heat sinks for integrated chip thermal management
8个月前
已完结
皖公网安备34019202002308
