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6 积分 2025-11-23 加入
Direct preparation of diamond heat dissipation microchannel assemblies by picosecond laser
4天前
已完结
Fully diamond-based embedded manifold microchannel heat sink: Achieving ultra-high heat flux cooling
21天前
已完结
Microchannel cooling for high-performance microelectronic systems: Progress, challenges, and future directions
2个月前
已完结
Microchannel cooling for high-performance microelectronic systems: Progress, challenges, and future directions
2个月前
已关闭
Co-designing electronics with microfluidics for more sustainable cooling
3个月前
已完结
Optimization of embedded cooling for hotspots based on compound plate thermal spreading model
3个月前
已完结
Thermal and hydraulic optimization of embedded manifold microchannel heat sink for chip cooling based on Tesla-pattern
3个月前
已完结
Cooling chip on PCB by embedded active microchannel heat sink
3个月前
已完结
Multi-objective topology optimization of through-silicon-via (TSV)-embedded microchannel heat sinks for integrated chip thermal management
3个月前
已完结
Jet-enhanced manifold microchannels for cooling electronics up to a heat flux of 3,000 W cm−2
3个月前
已完结
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