Lv4
490 积分 2024-06-09 加入
Point defects on the (110) surfaces ofInP,InAs, andInSb: A comparison with bulk
7小时前
待确认
Molecular dynamic simulation and experimental study on vacuum decomposition of InP scrap
3天前
已完结
Research on wafer warping monitoring based on digital twin
8天前
已关闭
A finite element analysis of temperature variation in silicon wafers during wiresaw slicing
8天前
已完结
Finite-Element Simulation of Different Kinds of Wafer Warpages: Spherical, Cylindrical, and Saddle
8天前
已完结
Correlated Model for Wafer Warpage Prediction of Arbitrarily Patterned Films
8天前
已完结
Implementation of the Homogenization Method in the Numerical Estimation of Wafer Warpage
8天前
已完结
Stress-warping relation in thin film coated wafers
8天前
已完结
Warping of silicon wafers subjected to back-grinding process
8天前
已完结
Warp of Silicon Wafers Produced from Wire Saw Slicing: Modeling, Simulation, and Experiments
8天前
已完结
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