Lv3
244 积分 2022-02-26 加入
Toward Advanced High‐k and Electrode Thin Films for DRAM Capacitors via Atomic Layer Deposition
1个月前
已完结
Dielectric Constant Enhancement and Leakage Current Suppression of Metal–Insulator–Metal Capacitors by Atomic Layer Annealing and the Capping Layer Effect Prepared with a Low Thermal Budget
1个月前
已完结
New On-Chip De-Embedding for Accurate Evaluation of Symmetric Devices
1个月前
已完结
De-Embedding Method Using EM Simulator for Device Characterization and Error Estimation of Conventional Method Using Open/Short-TEG
1个月前
已关闭
A reliability study of DRAM capacitors in chip for beyond 10 nm scaling
5个月前
已关闭
A reliability study of DRAM capacitors in chip for beyond 10 nm scaling
6个月前
已关闭
Growth, dielectric properties, and memory device applications of ZrO2 thin films
1年前
已完结
Atomic layer deposition of high-k and metal thin films for high-performance DRAM capacitors: a brief review
1年前
已完结
Exploring the Morphotropic Phase Boundary in HfO2-Based Ferroelectrics for Advanced High-k Dielectrics
1年前
已完结
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