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40 积分
2023-09-22 加入
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Laser-assisted surface grinding of innovative superhard SiC-bonded diamond (DSiC) materials
7天前
已完结
Residual stress distribution of silicon wafers machined by rotational grinding based on molecular dynamics
14天前
已完结
Development of nonresonant elliptical vibration cutting device based on parallel piezoelectric actuator
17天前
已完结
Determination of gradient residual stress for elastoplastic materials by nanoindentation
1个月前
已完结
Simulation of grinding surface topography considering wheel wear and wheel vibration
1个月前
已完结
Cutting speed dependence of material removal mechanism for monocrystal silicon
1个月前
已完结
Understanding machinability improvements and removal mechanism of ceramic matrix composites during laser-ablating assisted grinding
1个月前
已完结
Harmonics Generation in the Laser-Induced Plasmas of Metal and Semiconductor Carbide Nanoparticles
1个月前
已完结
Improvement of high-order harmonics from silver plasma plumes induced by femtoseconds laser pulses
1个月前
已完结
Critical life cycle inventory for aluminum die casting: A lightweight-vehicle manufacturing enabling technology
2个月前
已完结
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