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20 积分 2023-08-20 加入
Silicon particle pinhole defects in aluminium–silicon alloys
4小时前
待确认
Si epitaxial regrowth and grain structure of Al metallization on 〈100〉 Si
4小时前
已完结
Corrosion‐Induced Contact Failures in Double‐Level Al‐Si‐Cu Metallization
4小时前
求助中
Void-free chemically vapor-deposited aluminum dual inlaid metallization schemes for ultra-large-scale-integrated via and interconnect applications
4小时前
已完结
Al speed fill
2个月前
已完结
CVD Al/PVD Al integration for advanced via and interconnect technology
2个月前
已完结
The sprint process of Al interconnects with low-temperature PVD via filling
2个月前
已完结
Behavior of TiN and Ti Barrier Metals in Al‐Barrier‐Al Via Hole Metallization
3个月前
已完结
Diffusion barrier properties of TiN films for submicron silicon bipolar technologies
3个月前
已完结
Multistep nucleation and growth mechanisms of organic crystals from amorphous solid states
3个月前
已完结