Lv5
1070 积分 2025-09-03 加入
Co-packaged optics for high-performance computing and artificial intelligence
18天前
已完结
The Evolution of Organosilicon Precursors for Low-k Interlayer Dielectric Fabrication Driven by Integration Challenges
2个月前
已完结
Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV)
3个月前
已完结
The era of hyper-scaling in electronics
4个月前
已完结
Scaling effects on the microstructure and thermomechanical response of through silicon vias (TSVs)
5个月前
已完结
Carbon nanotube transistors: Making electronics from molecules
6个月前
已完结
The application of organic materials used in IC advanced packaging:A review
7个月前
已完结
Integrating silicon photonics with complementary metal–oxide–semiconductor technologies
8个月前
已完结
Parametric studies of nanoscale through-silicon vias under the reflow in advanced packaging
8个月前
已完结
Future interconnect materials for highly integrated semiconductor devices
8个月前
已完结
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