Lv5
960 积分 2025-04-24 加入
Enhancing Silver Sintering – Effect of Copper Substrate Microstructure on Silver Adhesion and Bond Strength
18天前
已完结
Effect of Cu–Sn intermetallic compound reactions on the Kirkendall void growth characteristics in Cu/Sn/Cu microbumps
25天前
已完结
Chip warpage and stress analysis in power modules of different substrate configurations
1个月前
已完结
Investigation of hygrothermally induced failures in multilayer ceramic capacitors during thermal reflow process
1个月前
已完结
Fabrication of Pressure Conductive Silicone Rubber Socket Device by Shape-Controlled Nickel Powders Produced by High-Energy Ball Milling
1个月前
已完结
Copper Die-Bonding Sinter Paste: Sintering and Bonding Properties
1个月前
已完结
Estimation of Adhesive Strength and Thermal Cycling Lifetime with MD Simulation and FEA for Die-Attach Sintering Paste (Cu, Ag)
1个月前
已完结
Recent advances in thermal properties of graphene/hexagonal boron nitride heterostructures and their polymer nanocomposites: A review
1个月前
已完结
Liquid‐Metal‐Enabled Materials Design for Soft Electronics
1个月前
已完结
Heat transfer impact of high-performance vapor chamber as integrated heat spreader of computing chips
1个月前
已完结
皖公网安备34019202002308
