Lv3
285 积分 2024-11-04 加入
A review of graphene reinforced Cu matrix composites for thermal management of smart electronics
1天前
待确认
Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics
1天前
已完结
Thermal design automation (TDA) for multiscale thermal management of electronics
14天前
已关闭
Low thermal expansion and high mechanical properties in Cu/diamond composite through bimodal particle strategy and interface structure regulation
27天前
已关闭
Surface modification of hard diamond particles with Cu-Mo2C double layer coating and its application in thermal conductive composites
27天前
已完结
Effect of Si-coated diamond on the relative density and thermal conductivity of diamond/W composites prepared by SPS
27天前
已关闭
Synergetic effect of diamond particle size on thermal expansion of Cu-B/diamond composite
29天前
已完结
Synergetic effect enabling high thermal conductivity in Cu/diamond composite
29天前
已完结
Enhanced thermal conductivity and thermal shock resistance in diamond/copper composites through diamond surface etching
1个月前
已完结
High thermal conductivity and strong interface bonding of a hot-forged Cu/Ti-coated-diamond composite
1个月前
已完结
皖公网安备34019202002308
