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28 积分 2026-04-22 加入
A hybrid pump-driven phase-change cooling system incorporating capillary evaporation and liquid-gas ejection for thermal management of high-heat-flux chip arrays
6小时前
已完结
Highly energy-efficient manifold microchannel for cooling electronics with a coefficient of performance over 100,000
25天前
已完结
A 0.25-mm-thick ultra-conductive thermal ground plane for cooling compact electronics
2个月前
已完结
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