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28 积分 2026-04-22 加入
Enhanced thermal conductivity and electrical resistivity of epoxy composite by constructing a close-packed two-dimensional network of diamond particles connected with chopped carbon fibers
2小时前
已完结
Breaking barriers in thermal interface materials: Ultrahigh thermal conductivity and electrical insulation in epoxy/diamond composites via multimodal packing and dual-mode interface engineering
3小时前
已完结
A hybrid pump-driven phase-change cooling system incorporating capillary evaporation and liquid-gas ejection for thermal management of high-heat-flux chip arrays
2个月前
已完结
Highly energy-efficient manifold microchannel for cooling electronics with a coefficient of performance over 100,000
3个月前
已完结
A 0.25-mm-thick ultra-conductive thermal ground plane for cooling compact electronics
4个月前
已完结
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