Lv6
1990 积分 2024-10-24 加入
System Electrothermal Transient Analysis of a High Current (40A) Synchronous Step Down Converter
11天前
已完结
WBLGA SiP High-Reliability and High-Thermal Conductivity Design Optimization and Interconnect Process Exploration
2个月前
已完结
Creep behavior of Sn58Bi solder alloy: experiments and modeling
10个月前
已完结
Improved performance and long-term reliability of copper paste in electronic packaging by adding copper-coated Si particles
10个月前
已完结
Automatic unstructured mesh generation approach for simulation of electronic packaging system
10个月前
已完结
Improved performance and long-term reliability of copper paste in electronic packaging by adding copper-coated Si particles
11个月前
已完结
Thermal Model of a Component Package for System Level Applications
11个月前
已完结
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