Lv6
2010 积分 2024-10-24 加入
Creep behavior of Sn58Bi solder alloy: experiments and modeling
6天前
已完结
Improved performance and long-term reliability of copper paste in electronic packaging by adding copper-coated Si particles
6天前
已完结
Automatic unstructured mesh generation approach for simulation of electronic packaging system
7天前
已完结
Improved performance and long-term reliability of copper paste in electronic packaging by adding copper-coated Si particles
26天前
已完结
Thermal Model of a Component Package for System Level Applications
28天前
已完结
A Hybrid Method for Predicting Fatigue Life of Lead-Free Solder Joints Under Coupled Electrical–Thermal–Mechanical Fields
1个月前
已完结
Electrothermal Analysis of System in Package for Aerospace Application
2个月前
已完结
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