Lv5
1230 积分 2024-10-24 加入
Characterization of Packaging‐Induced Stress Distributions for Small‐Scale Silicon Chips
2个月前
已完结
Chip warpage and stress analysis in power modules of different substrate configurations
2个月前
已完结
Effect of Hexagonal-Boron Nitride/Epoxy and BNNS/Epoxy Composite Materials on the Reliability of Flip Chip
2个月前
已完结
Loan Question Answering Platform Based on ERNIE and Knowledge Graph
2个月前
已完结
IndRNN-Based Data-Driven Modeling Integrated With Physical Knowledge for Engine Performance Monitoring
2个月前
已完结
Reliability of Electronic Packaging
4个月前
已完结
Reliability of Electronic Packaging
4个月前
已关闭
Digital twin-based tig welding quality prediction using electrode tip angle degradation influencing Industry 5.0 in manufacturing sector
5个月前
已完结
Semiconductor Packaging:Beginning of Sinter Joiningand Future
5个月前
已关闭
Graph-enabled cognitive digital twins for causal inference in maintenance processes
5个月前
已完结
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