Lv61
1960 积分 2024-10-24 加入
Investigation on the new reliability issues of PCB in 5G millimeter wave application
3个月前
已完结
PCB Materials and Design Requirements for 5G Systems
3个月前
已完结
Advanced packaging of chiplets for future computing needs
3个月前
已完结
Characterization of Packaging‐Induced Stress Distributions for Small‐Scale Silicon Chips
6个月前
已完结
Chip warpage and stress analysis in power modules of different substrate configurations
6个月前
已完结
Effect of Hexagonal-Boron Nitride/Epoxy and BNNS/Epoxy Composite Materials on the Reliability of Flip Chip
6个月前
已完结
Loan Question Answering Platform Based on ERNIE and Knowledge Graph
6个月前
已完结
IndRNN-Based Data-Driven Modeling Integrated With Physical Knowledge for Engine Performance Monitoring
7个月前
已完结
Reliability of Electronic Packaging
9个月前
已完结
Reliability of Electronic Packaging
9个月前
已关闭
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