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150 积分 2025-11-27 加入
High Selectivity BPF with Wide-Band and Stopband Exploiting 3D CRLH-SIW in Through Glass Via (TGV)-Based Package
5天前
已完结
Development of Long-term Reliability for Glass Core Substrates with Build-up layers
13天前
已完结
Degradation mechanisms and microstructure evolution of TGV-Cu vertical interconnects in glass wafer under high-temperature aging
13天前
已完结
Degradation mechanisms and microstructure evolution of TGV-Cu vertical interconnects in glass wafer under high-temperature aging
13天前
已完结
Modulation of near-infrared light at communication wavelength by graphene in Fabry-Perot cavity
19天前
已完结
Research on high inductance and quality factor embedded 3D inductors using ultra-high aspect ratio TGV technology
20天前
已完结
Development of Low Cost Glass-Based Deep Trench Capacitor for 3D Packaging
20天前
已完结
Research on high inductance and quality factor embedded 3D inductors using ultra-high aspect ratio TGV technology
26天前
已完结
Impact of DC Current Density on Filling Mechanism and Microstructural Evolution of Metallization in TGV
27天前
已完结
Research on a Glass Core Substrate Based on TGV Technology
1个月前
已完结
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