Lv31
240 积分 2025-11-27 加入
Ultrafast Picosecond Laser Drilling of Through-Glass Vias Using Hollow Bessel Beam Optics
5天前
已完结
Microstructural evolution, residual stress, and mechanical property heterogeneity of high-aspect-ratio TGV copper interconnects fabricated by laser-assisted wet etching
12天前
已完结
Enhancement of ultrashort laser pulses absorption in glass using single MHz burst
15天前
已完结
Investigation of the influence of nonlinear absorption properties on glass modification induced by femtosecond laser irradiation
20天前
已完结
Acoustic-streaming driven liquid filling patterns inside through-glass vias
1个月前
已完结
Acoustic-streaming driven liquid filling patterns inside through-glass vias
1个月前
已关闭
Gate-Tunable Transmissive Metasurfaces with Dual-Resonance-Enhanced Modulation
1个月前
已完结
Acoustic-streaming driven liquid filling patterns inside through-glass vias
1个月前
已关闭
High Selectivity BPF with Wide-Band and Stopband Exploiting 3D CRLH-SIW in Through Glass Via (TGV)-Based Package
1个月前
已完结
皖公网安备34019202002308
