Lv1
10 积分 2025-08-19 加入
Thermal management materials for 3D-stacked integrated circuits
11个月前
已完结
A high-power, power-efficient 1.3-μm SOA-integrated DFB laser for CPO applications
1年前
已完结
Athermal Travelling Wave Mach-Zehnder Modulators for Optical Interconnects
1年前
已关闭
Athermal Travelling Wave Mach-Zehnder Modulators for Optical Interconnects
1年前
已关闭
1.6T linear-drive optical engine for Chinese co-packaged optics standard
1年前
已完结
A Pathway to Thin GaAs Virtual Substrate on On‐Axis Si (001) with Ultralow Threading Dislocation Density
1年前
已完结
Reduced dislocation growth leads to long lifetime InAs quantum dot lasers on silicon at high temperatures
1年前
已完结
(Invited) Die to Wafer Direct Bonding: Overview of Processes for Optoelectronic and 3D at CEA
1年前
已关闭
Investigation of aspherical microlens based on reflow technique
1年前
已完结
(Invited) Die to Wafer Direct Bonding: Overview of Processes for Optoelectronic and 3D at CEA
1年前
已关闭
皖公网安备34019202002308
