Lv22
104 积分 2024-03-07 加入
Fabrication of high-aspect-ratio fused silica microstructures with large depths using Bessel-beam femtosecond laser-assisted etching
20天前
已完结
Reconstructing of Embedded High-Aspect-Ratio Nano-Voids Generated by Ultrafast Laser Bessel Beams
21天前
已完结
Research of Vertical via Based on Silicon, Ceramic and Glass
21天前
已完结
Development of Compact Millimeter-Wave Antenna by Stacking of Five Glass Wafers With Through Glass Vias
21天前
已完结
Live single cell imaging assays in glass microwells produced by laser-induced deep etching
22天前
已完结
Scanning strategy-dependent etching rate in the formation of through-via holes by femtosecond laser-assisted etching
22天前
已完结
Free‐Form Micro‐Optics Out of Crystals: Femtosecond Laser 3D Sculpturing
23天前
已完结
Scanning strategy-dependent etching rate in the formation of through-via holes by femtosecond laser-assisted etching
25天前
已完结
Advances in fabrication of micro-optical components by femtosecond laser with etching technology
26天前
已完结
Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching
26天前
已完结
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