Lv3
382 积分 2026-05-06 加入
Thermal performance of cold plates with novel pin-fins designed using Bézier curves
1天前
待确认
Thermal management of data centers: Chip-scale cooling using novel distributed inlet–outlet jet impingement liquid cold plate
1天前
已完结
Electrochemical additive manufacturing-based cold plate with distributed inlet nozzles and outlet slots for high-power-density electronics cooling
1天前
已完结
On the reticulate pattern and heat transfer performance of the topologically optimized microchannel heat sink
1天前
已完结
Numerical investigation on the cooling performance of lithium-ion battery using liquid cooled-plate with integrated grooves and secondary microchannel structures
7天前
已完结
Semi-porous-fin microchannel heat sinks for enhanced micro-electronics cooling
12天前
已完结
Design and performance study of a hydrophilic surface-treated jet microchannel liquid cooling system for chip heat dissipation
12天前
已完结
Effect of Cross-Sectional Geometry on Hydrothermal Behavior of Microchannel Heat Sink
1个月前
已完结
Sweat Gland‐Like Fabric for Personal Thermal‐Wet Comfort Management
5个月前
已完结
皖公网安备34019202002308
