Lv1
40 积分 2024-03-03 加入
Carpentry-inspired interfaces for improved electronic and thermal transport
3个月前
已完结
In situ thermal polymerization of hydrogel suppresses Leidenfrost effect up to 1,000°C for high-temperature thermal management
4个月前
已完结
A 0.25-mm-thick ultra-conductive thermal ground plane for cooling compact electronics
4个月前
已完结
High-flux and stable thin-film evaporation from fiber membranes with interconnected pores
6个月前
已完结
Flow Boiling Heat Transfer in a Lotus Leaf-Inspired Microchannel Heat Sink with Enhanced Critical Heat Flux for Large Area Chips
10个月前
已完结
ltra)wide bandgap semiconductor heterostructures for electronics cooling
10个月前
已完结
Jet-enhanced manifold microchannel for cooling electronics up to a heat flux of 3000 W/cm²
1年前
已完结
Origin and bifurcations in fishbone instabilities of impinging jets
1年前
已完结
Sustainable vaporization for electronics cooling via dynamic fluid delivery
1年前
已完结
皖公网安备34019202002308
