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Effects of porosity on electrical and thermal conductivities of porous SiC ceramics
3个月前
已完结
SnPbInBiSb high-entropy solder joints with inhibited interfacial IMC growth and high shear strength
3个月前
已完结
Interfacial reaction between novel high entropy alloy SnPbInBiSb and Cu substrate
3个月前
已完结
First-principles calculations of structural and elastic properties of Sn solid solution, Cu6Sn5 and SnSb in tin-based bearing alloy
6个月前
已完结
Three-dimensional morphologies of Cu Sn intermetallic compounds in lead-free solder particles and their formation mechanisms
6个月前
已完结
Insight into the improvement of service performance of Sn/Cu solder joint by Pt doping in Cu6Sn5 interfacial intermetallic compound
6个月前
已完结
Elastic properties, fracture toughness, electronic properties and thermal conductivity of In-doped η'-Cu6Sn5 in Sn-Cu solders using first-principles calculations
7个月前
已完结
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