Lv5
980 积分 2022-11-10 加入
Localized electrodeposition micro additive manufacturing of pure copper microstructures
2天前
已完结
A novel strategy for electrochemical additive manufacturing: Femtosecond laser-assisted localized electrochemical deposition
2天前
已完结
Direct preparation of diamond heat dissipation microchannel assemblies by picosecond laser
3天前
已完结
Research progress of diamond/copper composites with high thermal conductivity
4天前
已完结
Atomic-level insight into sequential evolution of nanocomposite carbon structures in femtosecond laser processing of diamond
6天前
已完结
Medicare chronic care improvement program puts the spotlight on case management
6天前
已完结
Synergistic design of bi-level heat sink combining topology-optimized microchannels with jet impingement for high-heat-flux applications
12天前
已完结
Chip cooling with manifold-capillary structures enables 105 COP in two-phase systems
12天前
已完结
Patterned liquid metal embedded in brush-shaped polymers for dynamic thermal management
19天前
已完结
Performance analysis of Gallium-based liquid metal as thermal interface material for chip heat dissipation
20天前
已完结
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