Lv4
478 积分 2024-07-07 加入
Highly Robust, Pressureless Silver Sinter-Bonding Technology Using PMMA Combustion for Power Semiconductor Applications
9天前
已完结
Fundamental microscopic properties as predictors of large-scale quantities of interest: Validation through grain boundary energy trends
16天前
已完结
Effect of isothermal aging on the interfacial reactions between Sn–0.4Cu solder and Cu substrate with or without ENIG plating layer
25天前
已完结
Influence of phosphorous content on microstructure development at the Ni-P Plating/SAC interface
25天前
已完结
Highly thermostable joint of a Cu/Ni–P plating/Sn–0.7Cu solder added with Cu balls
25天前
已完结
Effect of thickness in the SAC 305 plated layer on the interfacial reaction and mechanical properties of the CCSB joint assembled onto the OSP surface finished FR-4 PCB board
25天前
已完结
Influences of Mono-Ni(P) and Dual-Cu/Ni(P) Plating on the Interfacial Microstructure Evolution of Solder Joints
25天前
已完结
Microstructure, wetting characteristics and hardness of tin-bismuth-silver (Sn–Bi–Ag) solders on silver (Ag)-surface finished copper (Cu) substrates
25天前
已完结
Study on the interfacial reactions for Ag/Sn/Cu TLP during transient liquid phase soldering process
26天前
已完结
Growth of intermetallics between Sn/Ni/Cu, Sn/Ag/Cu and Sn/Cu layered structures
26天前
已完结
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