Lv4
434 积分 2024-07-07 加入
Simulation and Experimental Validation of Microstructure Evolution of Sintered Ag Layer During Thermal Aging Using a Hybrid Potts-Phase Field Model
6小时前
求助中
Applications, treatments, and reuse of plastics from electrical and electronic equipment
1个月前
已完结
Die-attach for power devices using the Ag sintering process: Interfacial microstructure and mechanical strength
1个月前
已完结
Investigation of fracture behavior of annealed electroless Ni-P coating on pipeline steel using acoustic emission methodology
1个月前
已完结
3D pyramid-shape Ag plating assisted interface connection growth of sinter micron-sized Ag paste
1个月前
已完结
Robust bonding and thermal-stable Ag–Au joint on ENEPIG substrate by micron-scale sinter Ag joining in low temperature pressure-less
1个月前
已完结
Low temperature SiC die-attach bonding technology by hillocks generation on Al sheet surface with stress self-generation and self-release
1个月前
已完结
Bonding technology based on solid porous Ag for large area chips
1个月前
已完结
Indentation and erosion behavior of electroless Ni-P coating on pipeline steel
1个月前
已完结
Highly Robust, Pressureless Silver Sinter-Bonding Technology Using PMMA Combustion for Power Semiconductor Applications
2个月前
已完结
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