Lv1
20 积分 2024-07-07 加入
Influence of ENIG defects on shear strength of pressureless Ag nanoparticle sintered joint under isothermal aging
21天前
已完结
Effect of Ni(P) Layer Thickness on Interface Reaction and Reliability of Ultrathin ENEPIG Surface Finish
21天前
已完结
Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices
21天前
已完结
Ag microflake-reinforced nano-Ag paste with high mechanical reliability for high-temperature applications
21天前
已完结
Pressureless Sintered-Silver as Die Attachment for bonding Si and SiC Chips on Silver, Gold, Copper, and Nickel Metallization for Power Electronics Packaging: The Practice and Science
22天前
已完结
A delamination study on metallization stacks of power semiconductors
22天前
已完结
Comparing the mechanical and thermal-electrical properties of sintered copper (Cu) and sintered silver (Ag) joints
22天前
已完结
Development of thermal shock-resistant of GaN/DBC die-attached module by using Ag sinter paste and thermal stress relaxation structure
22天前
已完结
Growth behavior of IMCs layer of the Sn–35Bi–1Ag on Cu, Ni–P/Cu and Ni–Co–P/Cu substrates during aging
22天前
已完结
皖公网安备34019202002308
