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70 积分 2025-07-23 加入
Simulation Based Design of Experiments of Power Cycling Tests using Die Top System Interconnect Technology Die Topy System (DTS(r))
2天前
已完结
Simulation and verification of a lifetime model based on front side metal degradation of sintered Die Top Systems (DTS®) in Power Cycling Tests
2天前
求助中
Advanced Die-attach by Metal-powder Sintering: The Science and Practice
4天前
已完结
Pressureless Sintered-Silver as Die Attachment for bonding Si and SiC Chips on Silver, Gold, Copper, and Nickel Metallization for Power Electronics Packaging: The Practice and Science
6天前
已完结
Considerations and Limits of Embedding Sensor Nodes for Structural Health Monitoring into Fiber Metal Laminates
1个月前
已完结
Breaking the strength-ductility trade-off via heterogeneous structure in FeCoCrNiMo0.2 high-entropy alloy
1个月前
已完结
Impact of heat treatment on the lifetime of wire-bonded power modules
1个月前
已完结
Effect of post bonding annealing on the reliability of Al based wire bondings in IGBTs
1个月前
已完结
Analytical modeling of thermo-mechanical stress for bond wire of IGBT module
1个月前
已完结
Effect of substrate surface finish on bonding strength of pressure-less sintered silver die-attach
1个月前
已完结
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