Lv2
120 积分 2025-07-23 加入
A Single Step Process for Die-Attach and Substrateattach with Pressure Assisted Sintering to Face Harsh Conditions
1个月前
已完结
Failure Evolution and Reliability Assessment of Epoxy Mold Compounds in Power Module Encapsulation
3个月前
已完结
Finite Element Analysis of Interfacial Delamination in Double Side Molding Power Module SiP During Reflow
3个月前
已完结
Failure evolution analysis of SiC power modules in electric-thermal-mechanical multi-physical fields
3个月前
已完结
Power cycling failure analysis of double side cooled IGBT modules for automotive applications
3个月前
已关闭
Process Development of Tlps Joint and Their Mechanical, Thermal and Power Cycling Reliability
3个月前
已完结
Noninvasive vagus nerve stimulation for migraine: a systematic review and meta-analysis of randomized controlled trials
4个月前
已完结
Novel Ag-Cu foam sheet with multi-layer composite structure for high performance joining of SiC power chips
4个月前
已完结
Rapid sintering by thermo-compression in air using a paste containing bimodal-sized silver-coated copper particles and effects of particle size and surface finish type
4个月前
已完结
Cu-Cu joint formation by low-temperature sintering of self-reducible Cu nanoparticle paste under ambient condition
4个月前
已完结
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