Lv2
120 积分 2025-07-23 加入
Low Temperature Silver Sinter Processes on ENIG Surfaces
1个月前
已关闭
Fabrication of hybrid silver flake pastes and its flexibility
2个月前
已完结
Simulation Based Design of Experiments of Power Cycling Tests using Die Top System Interconnect Technology Die Topy System (DTS(r))
2个月前
已完结
Simulation and verification of a lifetime model based on front side metal degradation of sintered Die Top Systems (DTS®) in Power Cycling Tests
2个月前
已关闭
Advanced Die-attach by Metal-powder Sintering: The Science and Practice
2个月前
已完结
Pressureless Sintered-Silver as Die Attachment for bonding Si and SiC Chips on Silver, Gold, Copper, and Nickel Metallization for Power Electronics Packaging: The Practice and Science
2个月前
已完结
Considerations and Limits of Embedding Sensor Nodes for Structural Health Monitoring into Fiber Metal Laminates
3个月前
已完结
Breaking the strength-ductility trade-off via heterogeneous structure in FeCoCrNiMo0.2 high-entropy alloy
3个月前
已完结
Impact of heat treatment on the lifetime of wire-bonded power modules
3个月前
已完结
Effect of post bonding annealing on the reliability of Al based wire bondings in IGBTs
4个月前
已完结
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