Lv3
280 积分 2026-06-09 加入
The development of thermal interface materials
1个月前
已完结
Boosted the thermal conductivity of liquid metal via bridging diamond particles with graphite
1个月前
已完结
Intermetallic compound formation and growth behavior at the interface between indium and Au/Ni(V) metallization
1个月前
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Indium thermal interface material microstructure as a function of thermal history and bonding metallization
1个月前
已完结
Strong coupling effects during Cu/In/Ni interfacial reactions at 280 °C
1个月前
已完结
A Fundamental Study on Interfacial Properties of Indium Thermal Interface Materials
1个月前
已完结
Interfacial reactions between pure indium solder and Au/Ni metallization
1个月前
已完结
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