Lv436
506 积分 2023-03-30 加入
Solvent-free high-performance photocurable 3D printing resin from a noncoplanar branched maleimide oligomer for high-resolution fabrication
1个月前
已完结
Tailoring Dielectric Properties and Dimensional Stability of Poly(Phenylene Ether) Using Bismaleimide Crosslinkers for High‐Frequency PCB Applications
1个月前
已完结
Functional glass fiber fabric-reinforced bismaleimide-triazine composites with enhanced dimensional stability and superior high-frequency dielectric performance for advanced electronic packaging
1个月前
已完结
Tailoring Dielectric Properties and Dimensional Stability of Poly(Phenylene Ether) Using Bismaleimide Crosslinkers for High‐Frequency PCB Applications
1个月前
已完结
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