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2270 积分 2025-07-16 加入
Temperature-dependent evolution of Al-Ge microstructures for wafer-level vacuum packaging of MEMS devices
4个月前
已完结
AlGe wafer bonding in ultra-high vacuum environment
6个月前
已完结
Temperature-dependent evolution of Al-Ge microstructures for wafer-level vacuum packaging of MEMS devices
6个月前
已完结
An adjustable Ar ion-beam activation strategy to achieve hydrophilic bonding of Si and diamond by deposited AlN interlayer
11个月前
已完结
Fundamentals of CTE-matched QST® substrate technology
1年前
已完结
Fundamentals of CTE-matched QST® substrate technology
1年前
已关闭
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