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50 积分 2024-07-23 加入
Finite Element Analysis of Printed Circuit Heat Exchanger Core for Creep and Creep-Fatigue Responses
3个月前
已完结
Fluid-Thermal-Mechanical Coupled Analysis and Optimized Design of Printed Circuit Heat Exchanger with Airfoil Fins of S-CO2 Brayton Cycle
3个月前
已完结
Heat transfer regimes and critical heat flux during spray cooling with subcooled water
4个月前
已关闭
Topological thermal transport
5个月前
已完结
Fabrication, experimentation and numerical simulation of micro channel heat sink for enhancing thermal performance of electronic devices
7个月前
已完结
Thermal management materials for 3D-stacked integrated circuits
7个月前
已完结
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