Lv11
36 积分 2024-10-16 加入
Large-Scale Glass Waveguide Circuit for Board-Level Optical Interconnects Between Faceplate and Co-Packaged Optical Transceivers
4小时前
待确认
Thermal management in copackaged optics: from device assembly to system operation
1个月前
已完结
Characterizing Electrode Materials and Interfaces in Solid-State Batteries
1个月前
已完结
Tin Oxide/Amphiphilic Polymer Double‐Layered Hole Transporter for High‐Efficiency Tin Perovskite Solar Modules
1个月前
已完结
Executing highly optimized sputtered interference-coating designs for colorimetry and light balance filters using broadband monitoring
7个月前
已完结
Bilateral form characterization of curved transparent components using chromatic confocal sensor
9个月前
已完结
皖公网安备34019202002308
