Lv11
16 积分 2024-07-27 加入
Molecularly engineered Polyarylene ether nitrile copolymers integrating high thermal resistance with ultralow dielectric loss for advanced electronic applications
10分钟前
已完结
Sulfur-containing compound in epoxy molding compound
4小时前
已完结
Free-Volume Hole Properties in Thermosetting Plastics Probed by Positron Annihilation Spectroscopy: Chain Extension Chemistry
14天前
已完结
Solvent-Free Synthesis of Organic–Inorganic Polyphosphoramide-Halloysite Nanohybrids for Thermally Stable and Fire-Resistant Polylactide
14天前
已完结
Free-Volume Hole Properties in Thermosetting Plastics Probed by Positron Annihilation Spectroscopy: Chain Extension Chemistry
14天前
已完结
Key Materials in Solder Mask Ink for Printed Circuit Board
1个月前
已完结
A Novel UV-curable Modified Epoxy Resin with High Glass Transition Temperature and Comprehensive Properties
3个月前
已完结
Strong Adhesion of Electroless Plated Copper by Optimizing Lamination Temperature of Epoxy Composite Film for Advanced Chip Packaging Substrates
1年前
已完结
Tailoring Dielectric Properties and Dimensional Stability of Poly(Phenylene Ether) Using Bismaleimide Crosslinkers for High‐Frequency PCB Applications
1年前
已完结
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