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20 积分 2024-07-27 加入
A Novel UV-curable Modified Epoxy Resin with High Glass Transition Temperature and Comprehensive Properties
2天前
已完结
Strong Adhesion of Electroless Plated Copper by Optimizing Lamination Temperature of Epoxy Composite Film for Advanced Chip Packaging Substrates
9个月前
已完结
Tailoring Dielectric Properties and Dimensional Stability of Poly(Phenylene Ether) Using Bismaleimide Crosslinkers for High‐Frequency PCB Applications
9个月前
已完结
Key Materials in Solder Mask Ink for Printed Circuit Board
11个月前
已完结
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