Lv11
38 积分 2024-09-23 加入
Effect of Wafer Backside Thin Film Thickness on Wafer Stealth Dicing Performance
3小时前
已完结
Development of Heat-Resistant UV-Curable Dicing Tape
3小时前
求助中
Water‐based UV curable hybrid urethane‐acrylates formed by acid–base interaction between tertiary amine containing polyurethane and acrylic acid for photocoating and ink applications
26天前
已完结
Dual Effects of Heterocycles and Flexible Long Chains in Pressure-Sensitive Adhesives for Broad-Temperature-Range Flexible Applications
1个月前
已关闭
Sustainable Acrylic Pressure-Sensitive Adhesives with High-Temperature Resistance and Reusability
1个月前
已关闭
Development of Anti-Static Acrylic Pressure Sensitive Adhesives Containing Reduced Graphene Oxide for Semiconductor Processing
1个月前
已完结
A Novel Ultra-Thin Dicing Die Attach Film for Various Dicing Processes
1个月前
已完结
Development of UV Curable Wafer Back Side Protection-Film - IR Shielding Type -
1个月前
已完结
A Novel UV Curable Wafer Back Side Protection Film
1个月前
已完结
Preparation of low viscosity and high flexibility epoxy acrylate and its application in UV-curable coatings
2个月前
已完结
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