Lv1
38 积分 2024-09-23 加入
Thinning and Dicing Process Integration of High Accuracy Using a Novel Self-Assembly Stage for Chip on Wafer
12天前
已完结
Development of Heat-Resistant UV-Curable Dicing Tape
12天前
已完结
Construction and effect of intramolecular hydrogen bond on solvent resistance of polymeric membranes and their application in impermeable membranes
1个月前
已完结
Controlled Thermal Imidization of Thermoplastic Polyimide for Temporary Bonding and Debonding in Advanced Packages
1个月前
已完结
Effect of Wafer Backside Thin Film Thickness on Wafer Stealth Dicing Performance
2个月前
已完结
Development of Heat-Resistant UV-Curable Dicing Tape
2个月前
已关闭
Water‐based UV curable hybrid urethane‐acrylates formed by acid–base interaction between tertiary amine containing polyurethane and acrylic acid for photocoating and ink applications
3个月前
已完结
Dual Effects of Heterocycles and Flexible Long Chains in Pressure-Sensitive Adhesives for Broad-Temperature-Range Flexible Applications
3个月前
已关闭
Sustainable Acrylic Pressure-Sensitive Adhesives with High-Temperature Resistance and Reusability
3个月前
已关闭
Development of Anti-Static Acrylic Pressure Sensitive Adhesives Containing Reduced Graphene Oxide for Semiconductor Processing
3个月前
已完结
皖公网安备34019202002308
