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High-density metastable annealing twin boundaries-induced extraordinary strain hardening in ultrafine-grained high-entropy alloy
12天前
已完结
A review on copper alloys with high strength and high electrical conductivity
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Twin evolution and work-hardening phenomenon of a bulk ultrafine grained copper with high thermal stability and strength-ductility synergy
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Manufacturing of pure copper with extraordinary strength-ductility-conductivity balance by cryorolling and annealing
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Cyclic deformation behavior in pure Cu with growth-in twins
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Microstructural evolution and nanostructure formation in copper during dynamic plastic deformation at cryogenic temperatures
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Ultrahigh Strength and High Electrical Conductivity in Copper
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Simultaneously Increasing the Ductility and Strength of Ultra‐Fine‐Grained Pure Copper
24天前
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Mechanical properties and rolling behaviors of nano-grained copper with embedded nano-twin bundles
24天前
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Non-twinning deformation mechanism of pure copper under high speed electromagnetic forming
24天前
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