Lv41
580 积分 2024-05-26 加入
An inverse adhesion problem for extracting interfacial pair potentials for the Al(0 0 1)/3C–SiC(0 0 1) interface
1小时前
待确认
Enhanced thermal stability by introducing TiN diffusion barrier layer between W and SiC
2个月前
已完结
Materials Quest for Advanced Interconnect Metallization in Integrated Circuits
4个月前
已完结
High Temperature Electronics
4个月前
已关闭
Materials for high-temperature digital electronics
4个月前
已完结
High Temperature Electronics
4个月前
已关闭
Electromigration-induced drift in damascene and plasma-etched Al(Cu). I. Kinetics of Cu depletion in polycrystalline interconnects
4个月前
已完结
Growth of conformal TiN thin film with low resistivity and impurity via hollow cathode plasma atomic layer deposition
4个月前
已完结
Near-Threshold Electromigration of Damascene Copper on TiN Barrier
4个月前
已关闭
1/f noise measurements for faster evaluation of electromigration in advanced microelectronics interconnections
4个月前
已完结
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