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10 积分 2024-02-21 加入
Viscoplastic creep and microstructure evolution of Sn-based lead-free solders at low strain
22天前
已完结
Current stressing-induced growth of Cu3Sn in Cu/Sn/Cu solder joints
22天前
已完结
Elastic stability criteria of seven crystal systems and their application under pressure: Taking carbon as an example
2个月前
已完结
Current stressing-induced growth of Cu3Sn in Cu/Sn/Cu solder joints
2个月前
已完结
Anomalous plastic deformation at surfaces: Nanoindentation of gold single crystals
2个月前
已完结
Critical Assessment 5: Thermodynamic data for vacancies
2个月前
已完结
Preparation of large Cu3Sn single crystal by Czochralski method
3个月前
已完结
Structural, electronic, and elastic properties of orthorhombic, hexagonal, and cubic Cu3Sn intermetallic compounds in Sn–Cu lead-free solder
3个月前
已完结
Formation of compounds and Kirkendall vacancy in the Cu–Sn system
5个月前
已完结
Cu-Sn Intermetallic Compound Joints for High-Temperature Power Electronics Applications
5个月前
已完结
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