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20 积分 2024-02-21 加入
Stabilization of η-Cu6Sn5 Intermetallic Compound by Zn Addition： First-Principles Investigation
3小时前
求助中
Initial stage of isothermal wetting of bulk Cu6Sn5, Cu3Sn and Cu substrates by liquid Sn
1天前
已完结
A Review: The wettability and oxidation resistance of sn-zn-x lead-free solder joints
3天前
已完结
Unveiling the hybridization process in a weakly hybridized ferromagnet by ultrafast optical spectroscopy
1个月前
已完结
Evolution of nano-Ag3Sn particle formation on Cu–Sn intermetallic compounds of Sn3.5Ag0.5Cu composite solder/Cu during soldering
1个月前
已完结
A review: lead free solder and its wettability properties
1个月前
已完结
Fast formation mechanism of Cu6Sn5 compound in Sn/Bi/Cu by atomic diffusion in Bi lattice
2个月前
已完结
Lithium storage properties of nanocrystalline eta-Cu Sn alloys prepared by ball-milling
2个月前
已完结
A reduced graphene oxide/Cu6Sn5 nanocomposite with enhanced cycling，stability for lithium storage
2个月前
已完结
Theoretical and experimental investigations on mechanical properties of (Fe,Ni)Sn2 intermetallic compounds formed in SnAgCu/Fe-Ni solder joints
2个月前
已关闭
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