Lv11
20 积分 2025-09-01 加入
Research on Multifault Testing Method for MIV Based on Grid Search and Random Forest
4个月前
已完结
Soft electronic vias and interconnects through rapid three-dimensional assembly of liquid metal microdroplets
4个月前
已完结
Liquid Metal/Poly(3,4-ethylenedioxythiophene):Poly(styrenesulfonate) Composite Hydrogels with Multi-Stage Gauge Factors, Pressure Resistance, and Wide pH Stability
4个月前
已完结
Room‐Temperature Liquid Metals for Flexible Electronic Devices
4个月前
已完结
Compression‐Durable Soft Electronic Circuits Enabled by Embedding Self‐Healing Biphasic Liquid‐Solid Metal Into Microstructured Elastomeric Channels
4个月前
已完结
Three-dimensional flexible electronics using solidified liquid metal with regulated plasticity
5个月前
已完结
Low-loss liquid metal interconnects for superconducting quantum circuits
11个月前
已完结
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