Lv64
1850 积分 2022-11-10 加入
Direct to Silicon Microfluidic Cooling for Datacenters
11天前
已完结
Electroplated Cu-Diamond Composite Thermal Vias for Interposer-Level Heat Management in 2.5D/3D Packages
22天前
已完结
Fracture Analysis for CoWoS Reliability Improvement
1个月前
已完结
Information technology - Data centre facilities and infrastructures
1个月前
已关闭
Highly energy-efficient manifold microchannel for cooling electronics with a coefficient of performance over 100,000
1个月前
已完结
Metamaterial-enhanced near-field radiative heat transfer
1个月前
已完结
A Review of DC-DC Converters for Modular Solid-State Transformers: Challenges, Comparative Analysis, and Design
2个月前
已完结
High Power Density Double-Sided Cooled SiC Power Module with Embedded Liquid-cooled Microcooler
2个月前
已完结
Active Power Buffer for Smoothing GPU Workload Transients in Data Center Power Delivery
2个月前
已完结
Vertical Power Delivery Module Design and Integration for 850A AI ASIC
2个月前
已完结
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