Lv5
880 积分 2022-02-24 加入
Synthesis and characterization of copper ink and direct printing of copper patterns by inkjet printing for electronic devices
1个月前
已完结
Truly Low Temperature Sintering of Printed Copper Ink Using Formic Acid
1个月前
已完结
Strong adhesion of polyvinylpyrrolidone-coated copper nanoparticles on various substrates fabricated from well-dispersed copper nanoparticle inks
1个月前
已完结
Surface coordination layer passivates oxidation of copper
1个月前
已完结
Scale-Up Foreseeable Fabrication of CoS-MoS2 for Efficient Deoxygenation of Lignin-Derived Phenolics to Arenes
1个月前
已完结
The formation of Cu-Cu joints by low temperature sintering Cu NPs with copper formate layer and its oxidation enhancement
2个月前
已完结
Low temperature and pressureless Cu-to-Cu direct bonding by green synthesized Cu nanoparticles
2个月前
已完结
Fabrication of reliable Cu-Cu joints by low temperature bonding isopropanol stabilized Cu nanoparticles in air
2个月前
已关闭
Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere
2个月前
已完结
The formation of Cu-Cu joints by low temperature sintering Cu NPs with copper formate layer and its oxidation enhancement
2个月前
已完结
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